| سال | هفته | ID | Title | ApplNo | IPC | Applicant | Subgroup | زیر گروه | رشته | شرح | Description |
|---|
2026 | 04 | WO/2025/071719 | DIE-TO-DIE INPUT/OUTPUT SIGNAL ROUTING UTILIZING OPPOSING DIE SURFACES IN INTEGRATED CIRCUIT COMPONENT PACKAGING | US2024/036801 | H01L 25/065 | INTEL CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2025/156191 | MICRO LIGHT-EMITTING DIODE SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | CN2024/074007 | H01L 33/00 | BOE TECHNOLOGY GROUP CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2025/259973 | MATRIX OF LID ASSEMBLIES FOR ELECTRONIC PACKAGES | US2025/033532 | H01L 21/50 | MATERION CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/016090 | AUXILARY GAS INJECTION SYSTEMS FOR SEMICONDUCTOR PORCESSING CHAMBERS, AND RELATED LINERS AND METHODS | CN2024/105974 | H01L 21/67 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/016427 | GAN DEVICE HAVING LOCALIZATION MARKS, VOLTAGE CONVERSION APPARATUS AND ELECTRONIC DEVICE | CN2025/070107 | H01L 23/544 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/016503 | PACKAGED CHIP, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE | CN2025/081116 | H01L 23/00 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/016625 | SUBSTRATE IN-SITU DETECTION SYSTEM AND IN-SITU DETECTION AND TRANSFER METHOD THEREFOR | CN2025/096174 | H01L 21/677 | WUXI LEADPRO TECHNOLOGY CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/016708 | PACKAGE STRUCTURE AND PREPARATION METHOD THEREFOR, AND ELECTRONIC DEVICE | CN2025/101555 | H01L 23/498 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/016725 | WAFER-LEVEL CHIP MANUFACTURING METHOD | CN2025/102110 | H01L 21/60 | SHENZHEN RUINA ELECTRONIC TECHNOLOGY DEVELOPMENT CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/016853 | POWER AMPLIFICATION CHIP, POWER AMPLIFICATION SYSTEM, AND ELECTRONIC DEVICE | CN2025/105741 | H01L 23/488 | VIVO MOBILE COMMUNICATION CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/016907 | INTEGRATED STRUCTURE OF DISCRETE POWER DEVICES AND CAPACITOR, MOTOR CONTROLLER, AND AUTOMOBILE | CN2025/106715 | H01L 25/16 | SHANGHAI VMAX NEW ENERGY CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/017270 | APPARATUS AND METHOD FOR SEPARATING AN ELECTRONICS COMPONENT FROM A FLEXIBLE, ADHESIVE FILM | EP2024/070642 | H01L 21/67 | NEXPERIA B.V. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/017271 | A METHOD FOR MOUNTING AN ELECTRONICS COMPONENT AT A PARTICULAR PLACEMENT LOCATION ON A CARRIER AS WELL AS A PICK-AND-PLACE APPARATUS FOR MOUNTING AN ELECTRONICS COMPONENT AT A PARTICULAR PLACEMENT LOCATION ON A CARRIER. | EP2024/070643 | H01L 21/67 | NEXPERIA B.V. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/017323 | OPTIMISATION OF THE ORIENTATION OF SUBSTRATES PASSING, IN BATCHES, INTO CHEMICAL TREATMENT BATHS | EP2025/066235 | H01L 21/67 | SOITEC | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/017336 | METHOD FOR PREPARING A SUBSTRATE COMPRISING A THIN LAYER OF PIEZOELECTRIC MATERIAL TRANSFERRED TO A CARRIER | EP2025/066673 | H01L 21/02 | SOITEC | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/017338 | SUBSTRATE SUPPORT | EP2025/066683 | H01L 21/683 | ASML NETHERLANDS B.V. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/017347 | SEMICONDUCTOR ARRANGEMENT HAVING AT LEAST ONE SEMICONDUCTOR ELEMENT, A FIRST CIRCUIT CARRIER AND A SECOND CIRCUIT CARRIER | EP2025/067008 | H01L 23/31 | SIEMENS AKTIENGESELLSCHAFT | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/017365 | SEMICONDUCTOR STRUCTURE | EP2025/067687 | H01L 21/768 | AMS-OSRAM AG | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/017397 | SUBSTRATE SUPPORT, METHOD FOR LOADING A SUBSTRATE ON A SUBSTRATE SUPPORT AND LITHOGRAPHIC APPARATUS | EP2025/068581 | H01L 21/687 | ASML NETHERLANDS B.V. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/017882 | METHOD FOR MONITORING A STATE OF A CONTAINER OR CONTAINER COMPONENT, AND INSPECTION SYSTEM | EP2025/070712 | H01L 21/673 | BROOKS AUTOMATION (GERMANY) GMBH | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018201 | METHOD FOR MOUNTING COMPONENTS AND DEVICE SUITABLE THEREFOR | IB2025/057262 | H01L 21/67 | BESI SWITZERLAND AG | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018302 | CIRCUIT BOARD WITH HEAT SINK, ELECTRICAL CONNECTION BOX, AND METHOD FOR MANUFACTURING CIRCUIT BOARD WITH HEAT SINK | JP2024/025466 | H01L 23/36 | AUTONETWORKS TECHNOLOGIES, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018303 | SEMICONDUCTOR DIE AND THREE-DIMENSIONAL LAMINATION DEVICE | JP2024/025471 | H01L 25/07 | SOCIONEXT INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018318 | SEMICONDUCTOR DEVICE | JP2024/025568 | H01L 27/04 | SOCIONEXT INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018365 | ELECTRIC POWER CONVERSION DEVICE | JP2024/025707 | H01L 23/28 | ASTEMO, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018366 | POWER CONVERSION DEVICE | JP2024/025709 | H01L 23/28 | ASTEMO, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018378 | LIGHT DETECTION DEVICE AND DISTANCE MEASUREMENT DEVICE | JP2024/025784 | H01L 31/107 | SONY SEMICONDUCTOR SOLUTIONS CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018379 | SEMICONDUCTOR DEVICE | JP2024/025785 | H01L 27/04 | SOCIONEXT INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018399 | SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING SEMICONDUCTOR MODULE | JP2024/025866 | H01L 23/48 | ASTEMO, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018407 | LIGHT DETECTION DEVICE | JP2024/025909 | H01L 27/146 | SONY SEMICONDUCTOR SOLUTIONS CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018415 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | JP2024/025947 | H01L 21/02 | ASTEMO, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018426 | SUBSTRATE PROCESSING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, PROGRAM, AND SUBSTRATE PROCESSING APPARATUS | JP2024/025970 | H01L 21/316 | KOKUSAI ELECTRIC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018431 | IMAGING ELEMENT AND IMAGING DEVICE | JP2024/025987 | H01L 27/146 | SONY SEMICONDUCTOR SOLUTIONS CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018472 | CERAMIC HEATER | JP2024/046003 | H01L 21/683 | NGK INSULATORS, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018476 | SEMICONDUCTOR MANUFACTURING DEVICE | JP2025/004781 | H01L 21/301 | KINGSEMI JAPAN CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018495 | COMPOSITE COMPONENT AND MEMBER FOR SEMICONDUCTOR MANUFACTURING DEVICE | JP2025/013442 | H01L 21/683 | NGK INSULATORS, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018508 | SEMICONDUCTOR MODULE | JP2025/014935 | H01L 25/18 | RESEARCH ASSOCIATION FOR ADVANCED SYSTEMS | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018538 | THERMAL INTERFACE MATERIAL AND ON-VEHICLE ELECTRONIC CONTROL UNIT USING SAID THERMAL INTERFACE MATERIAL | JP2025/017036 | H01L 23/36 | ASTEMO, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018558 | FILM FORMATION METHOD AND FILM FORMATION DEVICE | JP2025/018594 | H01L 21/3065 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018559 | LIFTING DEVICE AND LIFTING METHOD | JP2025/018601 | H01L 21/683 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018560 | SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE | JP2025/018662 | H01L 23/04 | SONY SEMICONDUCTOR SOLUTIONS CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018570 | LAYERED STRUCTURE | JP2025/019261 | H01L 21/203 | JAPAN DISPLAY INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018577 | SEMICONDUCTOR DEVICE | JP2025/019671 | H01L 25/07 | SHINDENGEN ELECTRIC MANUFACTURING CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018578 | SEMICONDUCTOR DEVICE | JP2025/019672 | H01L 25/07 | SHINDENGEN ELECTRIC MANUFACTURING CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018614 | POWER SEMICONDUCTOR DEVICE | JP2025/021844 | H01L 23/48 | ASTEMO, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018623 | CERAMIC HEATER | JP2025/022422 | H01L 21/683 | NGK INSULATORS, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018641 | SEMICONDUCTOR DEVICE BONDING METHOD | JP2025/022900 | H01L 21/60 | YAMAHA ROBOTICS HOLDINGS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018651 | SEMICONDUCTOR DEVICE | JP2025/023140 | H01L 23/48 | DENSO CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018665 | MANUFACTURING APPARATUS FOR SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | JP2025/023445 | H01L 21/52 | YAMAHA ROBOTICS HOLDINGS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018686 | PLASMA PROCESSING APPARATUS AND UPPER ELECTRODE ASSEMBLY | JP2025/023794 | H01L 21/3065 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018701 | PLASMA TREATMENT DEVICE AND RECIPE REGISTRATION METHOD | JP2025/023977 | H01L 21/3065 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018702 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE PRODUCTION METHOD, AND ELECTRONIC APPARATUS | JP2025/023999 | H01L 21/60 | SONY SEMICONDUCTOR SOLUTIONS CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018704 | PLASMA PROCESSING APPARATUS, BIAS POWER SOURCE, AND PLASMA PROCESSING METHOD | JP2025/024043 | H01L 21/3065 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018725 | METHOD FOR TREATING SUBSTRATE, AND APPARATUS FOR TREATING SUBSTRATE | JP2025/024261 | H01L 21/768 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018726 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | JP2025/024303 | H01L 25/04 | ROHM CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018730 | PLASMA TREATMENT DEVICE AND POWER SOURCE SYSTEM | JP2025/024335 | H01L 21/3065 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018733 | ALIGNMENT MARK AND METHOD FOR USING SAME | JP2025/024348 | H01L 21/60 | TAZMO CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018739 | INSPECTION APPARATUS AND INSPECTION JIG | JP2025/024428 | H01L 21/66 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018771 | COMPOSITION, STOCK SOLUTION, METHOD FOR MANUFACTURING CLEANED OBJECT TO BE TREATED, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | JP2025/024846 | H01L 21/304 | FUJIFILM CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018793 | SIC COMPOSITE SUBSTRATE, METHOD FOR MANUFACTURING SIC COMPOSITE SUBSTRATE, AND SEMICONDUCTOR DEVICE | JP2025/025007 | H01L 21/205 | ROHM CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018807 | METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE | JP2025/025087 | H01L 21/304 | KAO CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018896 | EPITAXIAL SUBSTRATE AND SEMICONDUCTOR ELEMENT | JP2025/025576 | H01L 21/20 | NGK INSULATORS, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/018912 | COPPER-BASED WIRE MATERIAL AND SEMICONDUCTOR DEVICE | JP2025/025703 | H01L 21/60 | FURUKAWA ELECTRIC CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/019059 | HEAT DISSIPATION MEMBER | KR2025/007384 | H01L 23/373 | THE GOODSYSTEM CORP. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/019105 | SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING SAME | KR2025/009228 | H01L 21/677 | STI CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/019129 | DISPLAY DEVICE | KR2025/009608 | H01L 25/075 | SAMSUNG DISPLAY CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/019149 | METHOD FOR ALIGNING AND TESTING DEVICE HAVING FINE PITCH | KR2025/009995 | H01L 21/68 | AMT CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/019272 | REACTION BY-PRODUCT COLLECTION APPARATUS | KR2025/010525 | H01L 21/67 | MMT CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/019460 | SUBSTRATE PROCESSING SYSTEM USING AN OPTICAL PATTERN | US2025/022819 | H01L 21/3065 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/019463 | SELECTIVE ETCH OF TITANIUM CARBIDE MATERIALS USING OXIDATION | US2025/024607 | H01L 21/311 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/019469 | NOVEL OVERLAYER FILMS AND METHODS FOR ETCHING SILICON-CONTAINING MATERIALS USING A LOW TEMPERATURE DRY CHEMICAL ETCH PROCESS | US2025/026979 | H01L 21/311 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/019490 | CURABLE COMPOSITION AND COATED SUPERSTRATE | US2025/031915 | H01L 21/67 | CANON KABUSHIKI KAISHA | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/019530 | SYSTEM AND METHOD FOR REDUCING ELECTRICAL POWER CONSUMPTION OF HOT PLATE | US2025/034662 | H01L 21/67 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/019684 | SYSTEMS AND METHODS FOR WAFER OVERVIEW IMAGE SCAN AND PRE-ALIGNMENT OF FILM FRAME CARRIER | US2025/037481 | H01L 21/68 | KLA CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/019688 | SELECTIVE DEPOSITION OF LINER LAYER | US2025/037493 | H01L 21/32 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/019724 | HYBRID BONDED MEMORY AND LOGIC DEVICES | US2025/037570 | H01L 23/00 | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/019766 | HIGH ASPECT RATIO PLASMA ETCHING WITH CONTROLLED DECLOGGING | US2025/037656 | H01L 21/311 | LAM RESEARCH CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/019849 | ELECTROSTATIC CHUCK WITH PROTECTIVE COATING | US2025/037782 | H01L 21/683 | ENTEGRIS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/019864 | SEMICONDUCTOR DIE RELEASING WITHIN CARRIER WAFER | US2025/037815 | H01L 23/00 | MICRON TECHNOLOGY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/019866 | CLEAVING SYSTEMS AND METHODS FOR CLEAVING SEMICONDUCTOR STRUCTURES BY COMBINED THERMAL AND MECHANICAL STRESS INDUCTION | US2025/037820 | H01L 21/67 | GLOBALWAFERS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/019906 | FDSOI STRUCTURES AND METHODS FOR PREPARING FDSOI STRUCTURES | US2025/037891 | H01L 21/02 | GLOBALWAFERS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/019957 | APPARATUS WITH REDUCED INTERCONNECT PITCH AND METHODS OF MANUFACTURING THE SAME | US2025/037954 | H01L 23/00 | MICRON TECHNOLOGY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/019967 | SEMICONDUCTOR DEVICE WITH A TWO-SIDED REDISTRIBUTION LAYER | US2025/037974 | H01L 23/00 | MICRON TECHNOLOGY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/019972 | SYSTEMS AND METHODS FOR ANALYZING SEMICONDUCTOR WAFER DEFECTS USING SURFACE INSPECTION TOOLS | US2025/037980 | H01L 21/66 | GLOBALWAFERS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/020053 | POLYMER MATERIAL GAP-FILL WITH ELECTRICAL CONNECTIONS FOR HYBRID BONDING IN A STACKED SEMICONDUCTOR SYSTEM | US2025/038153 | H01L 23/528 | MICRON TECHNOLOGY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/020099 | UNIVERSAL RING WAFER SUPPORT APPARATUS | US2025/038247 | H01L 21/687 | GREEN TECHNOLOGY INVESTMENTS, LLC | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 04 | WO/2026/020122 | FACET SUPPRESSION FOR EPITAXIAL GROWTH | US2025/038287 | H01L 21/02 | TEXAS INSTRUMENTS INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای |